Underfill epoxy offers high glass transition temperature and low viscosity
Design World
APRIL 11, 2024
Master Bond EP114 is a two-component, low viscosity, NASA low outgassing rated, heat-cured epoxy that can be effectively utilized for underfill, coating, impregnating, and porosity sealing applications. This optically clear compound features high dimensional stability due to its nano-silica filler material. It has been successfully tested for abrasion resistance per ASTM D4060-14 and readily withstands… The post Underfill epoxy offers high glass transition temperature and low viscosity app
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