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X-FAB and SMART Photonics Collaborate to Enable Multi-Terabit Transceivers with Silicon Photonics and InP Integration

i4.0 today

It is also a great opportunity to build a strong European value chain.” The aim is to support lead customers with industrial prototyping by 2026, with risk production readiness by 2027. This will allow our customers to develop innovative solutions addressing the societal challenges of our times such as decarbonization.

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Ampere and STMicroelectronics Collaborate on Powerbox with Long Term Supply for Silicon Carbide

i4.0 today

It perfectly aligns with Ampere’s strategy to master the entire value chain of power electronics for its e-powertrain, leveraging STMicroelectronics’ expertise in power modules,” said Philippe Brunet, SVP Powertrain & EV engineering, Ampere. “ST

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Euro Manganese Announces Offtake Term Sheet with Wildcat Discovery Technologies

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based plant expected 2026 – 2027 to produce a portfolio of safe sustainable, and cobalt/nickel-free cathode materials for electric vehicle battery cells and other markets including stationary storage. Consistent and significant progress in Wildcat’s technology has led to a focus exclusively on nickel and cobalt free cathode production.

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Photonic Integrated Circuit Market to Surpass US$50B by 2035

i4.0 today

The biggest driver of the development of PIC transceivers is AI, as higher-performance AI accelerators will require higher-performance transceivers, with 3.2Tbps transceivers expected to arrive by 2026. What are the future applications? A breakdown of Co-Packaged Optics and its key concepts.